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Product Name : Sil-Pad BM-K4

Sil-Pad(BM-K4) is a kind of clean, without oil, soft thermal conductive and insulation materials, organic silicone resin and thermal conductive filler material as the surface layer of thermal conductive, intermediate carrier for polyimide film, through the dual function of base material and auxiliary material, for this kind of material with good thermal conductivity and insulation performance.

BM-K4 High dielectric strength, widely used in all kinds of thermal conductive and insulation, typical applications in a variety of electronic devices and the radiator or other heat dissipation between components.

Features:

1.Thermal resistance : 0.56℃-in2/W (@ 50psi)

2.Smooth and height of the surface

3.Lower fastening pressure

4.Good electrical insulation

Application:

1.Motor control, communication equipment

2.Power semiconductor, IS MOS tube IGBT chip 

3.Large power source and automobile electronic heating module

4.Strong voltage ,high temperature, high power welding machine etc.

5.Military, aviation

6.Heating power device